• DocumentCode
    1495175
  • Title

    Emulsion, foams, and thin films [Book Review]

  • Author

    Shea, John ; Schoch, K.F.

  • Volume
    17
  • Issue
    3
  • fYear
    2001
  • Firstpage
    71
  • Lastpage
    71
  • Keywords
    Assembly; Book reviews; Design engineering; Electronic packaging thermal management; Electronics packaging; Kinetic theory; Polymer films; Silicon compounds; Suspensions; Transistors;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2001.925309
  • Filename
    925309