DocumentCode
1495175
Title
Emulsion, foams, and thin films [Book Review]
Author
Shea, John ; Schoch, K.F.
Volume
17
Issue
3
fYear
2001
Firstpage
71
Lastpage
71
Keywords
Assembly; Book reviews; Design engineering; Electronic packaging thermal management; Electronics packaging; Kinetic theory; Polymer films; Silicon compounds; Suspensions; Transistors;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.2001.925309
Filename
925309
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