3D UV-microforming: principles and applications

Author

Qu, Wenmin

Author_Institution

Dept. of Commun. & Electron. Eng., R. Melbourne Inst. of Technol., Vic., Australia

Volume

8

Issue

1

fYear

1999

fDate

2/1/1999 12:00:00 AM

Firstpage

13

Lastpage

19

Abstract

A low-cost surface micromachining technology is described and examples provided of its application to microsensor and microactuator fabrication. The new technology 3D UV-macroforming, combines depth ultraviolet (UV) lithographic patterning of very thick photoresists and electrodeposition of structural materials into the patterned resist moulds. Neither UV lithography nor electrodeposition needs expensive or special equipment. Micromechanical components with high structures can be directly manufactured onto the system surface. Movable three-dimensional (3D) microstructures with a high aspect ratio can be obtained by combining the 3D UV-microforming process with a sacrificial layer technique. As an example of an advanced application in microsystem technology, the fabrication of triaxial accelerometers is presented, using titanium as a sacrificial layer and nickel as the structural material

Keywords

accelerometers; electrodeposition; micromachining; microsensors; photoresists; ultraviolet lithography; 3D UV-microforming; Ni; Ti; depth ultraviolet lithographic patterning; high aspect ratio; low-cost surface micromachining; microactuator fabrication; micromechanical components; microsensor fabrication; movable 3D microstructures; nickel structural material; patterned resist moulds; sacrificial layer technique; structural materials electrodeposition; titanium sacrificial layer; triaxial accelerometers; very thick photoresists;

fLanguage

English

Journal_Title

Engineering Science and Education Journal

Publisher

iet

ISSN

0963-7346

Type

jour

DOI

10.1049/esej:19990103

Filename

756470