• DocumentCode
    1499655
  • Title

    Composite core Nb3Sn wires: preparation and characterization

  • Author

    Flükiger, R. ; Specking, W. ; Klemm, M. ; Gauss, S.

  • Author_Institution
    Kernforschungszentrum Karlsruhe, Inst. fuer Tech. Phys., West Germany
  • Volume
    25
  • Issue
    2
  • fYear
    1989
  • fDate
    3/1/1989 12:00:00 AM
  • Firstpage
    2192
  • Lastpage
    2199
  • Abstract
    Powder metallurgically processed composite-core Nb3Sn wires, a novel type with filaments containing controlled amounts of normal conducting inclusions elongated in the wire axis, e.g., Ta or NbTi, have recently been developed. Composite cores replace the Nb cores, which are inserted either in a CuSn or in a Cu matrix for producing wires by the bronze route or by the internal Sn diffusion process, respectively. The ductile inclusions are deformed during the wire drawing process to long ribbons being <100 nm apart. If the reaction temperature is sufficiently low, the Ta or NbTi shows little reaction with the Nb3Sn phase but reduces the A15 grain growth in the radial direction. The resulting enhanced pinning at the grain boundaries (artificial pinning) leads to higher critical-current densities, particularly in the field range B<14 T. A difference between the observed field dependence for Ta and NbTi inclusions in the present configuration is explained by different degrees of prestress. The achievement of higher Jc values at 10-12 T may be advantageous for their application in fusion magnets
  • Keywords
    critical current density (superconductivity); flux pinning; grain boundaries; niobium alloys; powder metallurgy; tin alloys; type II superconductors; A15 grain growth; Nb3Sn; composite-core; critical-current densities; filaments; grain boundaries; pinning; ribbons; superconductor; wires; Alloying; Grain boundaries; Grain size; Niobium compounds; Powders; Temperature; Thermodynamics; Tin; Titanium compounds; Wires;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.92745
  • Filename
    92745