A simplified modeling technique for finite element thermal analysis of a plastic SOIC package

Author

Mak, Tony W C ; Feinstein, Leo G.

Author_Institution

Dallas Semicond. Corp., TX, USA

Volume

22

Issue

1

fYear

1999

fDate

3/1/1999 12:00:00 AM

Firstpage

6

Lastpage

10

Abstract

The purpose of this paper is to introduce an approximate analysis method which is incorporated with an ANSYS finite element program for thermal finite element analysis of a surface mount plastic package mounted on a PC board. A numerical example is given in the paper to demonstrate the application of this technique, and the numerical prediction agrees well with the experimental results. This proposed technique can be applied to solve other thermal problems such as the analysis of any surface mount or through hole type of plastic package mounted on a PC board or can be used for determining junction temperatures of multiple power components mounted on a board

Keywords

finite element analysis; integrated circuit packaging; plastic packaging; surface mount technology; thermal analysis; thermal management (packaging); ANSYS program; PC board; finite element model; junction temperature; numerical simulation; plastic SOIC package; power component; surface mount package; thermal analysis; Analytical models; Circuits; Electronic packaging thermal management; Finite difference methods; Finite element methods; Heat transfer; Plastic packaging; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.759346

Filename

759346