Nickel/palladium finish for leadframes

Author

Abbott, Donald C.

Author_Institution

Texas Instrum. Inc., Attleboro, MA, USA

Volume

22

Issue

1

fYear

1999

fDate

3/1/1999 12:00:00 AM

Firstpage

99

Lastpage

103

Abstract

The structure (and its rationale) of the palladium/nickel leadframe finish which Texas Instruments introduced in 1989 is reviewed and the reasons for its development, the advantages and features of this lead finish are discussed. Unique implications for the leadframe maker, the assembly test site and for the end user, result from using this finish, some of which were not anticipated at its inception. There are now more than 30 billion devices in the field with palladium/nickel plated leads. A synopsis of the performance of this finish with one of the lead-free pastes in the market is included. There is also a section on the observed shelf life of this finish under Battelle class 2 mixed flowing gas conditions

Keywords

electroplated coatings; integrated circuit packaging; nickel; palladium; IC assembly; Ni-Pd; Texas Instruments; high density packaging; lead-free paste; leadframe plating; nickel/palladium finish; shelf life; Assembly; Bonding; Copper; Environmentally friendly manufacturing techniques; Instruments; Lead compounds; Nickel; Palladium; Testing; Wire;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.759358

Filename

759358