• DocumentCode
    1500086
  • Title

    Moisture ingress into organic laminates

  • Author

    Pecht, Michael G. ; Ardebili, Haleh ; Shukla, Anand A. ; Hagge, John K. ; Jennings, David

  • Author_Institution
    CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
  • Volume
    22
  • Issue
    1
  • fYear
    1999
  • fDate
    3/1/1999 12:00:00 AM
  • Firstpage
    104
  • Lastpage
    110
  • Abstract
    The electronic industry´s most common laminates (FR-4, HTFR-4, PI, CE, and BT) were investigated for their equilibrium levels of moisture and diffusion rates and monitored for their moisture content as a function of electrical capacitance. Isothermal sorption tests were performed on the laminates to find the equilibrium moisture content in each laminate at various environmental conditions. The moisture content of each laminate was evaluated as a function of electrical capacitance via a capacitance monitoring plate attached to each laminate. A model was developed to assess the equilibrium content as a function of both temperature and humidity. Data from the sorption-time experiments was used to evaluate a diffusion coefficient for each laminate. The Fickian model was used to facilitate the evaluation. The results of the laminate moisture content analyses were subsequently applied to a printed wiring board (PWB) with a capacitor plate on each of its laminates. The capacitance method of moisture measurement in PWB shows slower moisture ingress than the theoretical moisture diffusion based on laminate experiments
  • Keywords
    capacitance; diffusion; laminates; moisture; organic compounds; sorption; BT; CE; FR-4; Fickian model; HTFR-4; PI; diffusion coefficient; electrical capacitance; equilibrium moisture content; isothermal sorption; moisture ingress; organic laminate; printed wiring board; Capacitance; Electronics industry; Humidity; Isothermal processes; Laminates; Moisture; Performance evaluation; Temperature; Testing; Wiring;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.759359
  • Filename
    759359