Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure

Author

Lin, A.W.

Author_Institution

AT&T Bell Lab., Murray Hill, NJ, USA

Volume

13

Issue

1

fYear

1990

fDate

3/1/1990 12:00:00 AM

Firstpage

207

Lastpage

213

Abstract

Using a temperature-humidity-bias (THB) screening test, nine commercial polyimides were evaluated for applications to multichip packages with a multilevel interconnection structure. Among these polyimides, DuPont PI2555 performed best under the test condition, i.e. 85°C/85%RH (relative humidity)/180-V DC bias over 3-mil spacing. However, a slow increase of leakage current was observed in situ on TiPdAu triple-track test samples coated with PI2555. This THB performance was improved by modifying PI2555 with a proprietary additive. However, the thermal stability of PI2555 was degraded by the additive. The dielectric constant of the modified PI2555 was 3.4 at 1 kHz, which is similar to that of PI2555

Keywords

environmental testing; hybrid integrated circuits; leakage currents; materials testing; permittivity; polymers; 1 kHz; 180 V; 3 mil; 85 C; DuPont PI2555; THB performance; TiPdAu triple-track test samples; additive; dielectric constant; dielectric materials; leakage current; multichip packages; multilevel interconnection structure; permittivity; polyimides evaluation; temperature-humidity-bias screening tests; thermal stability; Additives; Dielectric materials; Humidity; Leakage current; Packaging; Performance evaluation; Polyimides; Testing; Thermal degradation; Thermal stability;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.52872

Filename

52872