DocumentCode
1501916
Title
Modeling of simultaneous switching noise in high speed systems
Author
Chun, Sungjun ; Swaminathan, Madhavan ; Smith, Larry D. ; Srinivasan, Jegannathan ; Jin, Zhang ; Iyer, Mahadevan K.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
24
Issue
2
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
132
Lastpage
142
Abstract
Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex: due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems
Keywords
application specific integrated circuits; high-speed integrated circuits; integrated circuit modelling; integrated circuit noise; logic CAD; circuit models; digital design; high speed systems; simultaneous switching noise; superposition theory; system level modeling approach; test vehicle; Computational modeling; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Integrated circuit noise; Power system modeling; Semiconductor device noise; Switches; Switching circuits;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.928747
Filename
928747
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