• DocumentCode
    1501916
  • Title

    Modeling of simultaneous switching noise in high speed systems

  • Author

    Chun, Sungjun ; Swaminathan, Madhavan ; Smith, Larry D. ; Srinivasan, Jegannathan ; Jin, Zhang ; Iyer, Mahadevan K.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2001
  • fDate
    5/1/2001 12:00:00 AM
  • Firstpage
    132
  • Lastpage
    142
  • Abstract
    Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex: due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems
  • Keywords
    application specific integrated circuits; high-speed integrated circuits; integrated circuit modelling; integrated circuit noise; logic CAD; circuit models; digital design; high speed systems; simultaneous switching noise; superposition theory; system level modeling approach; test vehicle; Computational modeling; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Integrated circuit noise; Power system modeling; Semiconductor device noise; Switches; Switching circuits;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.928747
  • Filename
    928747