• DocumentCode
    150486
  • Title

    Inductor loss analysis of various materials in interleaved boost converters

  • Author

    Itoh, Yoshio ; Kimura, Shunji ; Imaoka, Jun ; Yamamoto, Manabu

  • Author_Institution
    Shimane Univ., Matsue, Japan
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    980
  • Lastpage
    987
  • Abstract
    High power density DC/DC converters have gained attention in automotive applications for Electric and Hybrid Vehicles. Inductors often appear as the largest component in DC/DC converters. DC/DC converters using a coupled inductor are well-known as one of the topologies which can achieve miniaturization of a magnetic component. Temperature of an inductor tends to be higher in high power density DC/DC converters. Thus, an optimal magnetic property selection is necessary for magnetic designs. In this paper, we have analyzed the relationship between inductor losses that affects the heat and inductor volume as the previous stage of the thermal analysis in the inductor. In addition, this paper presents analytical comparisons of various magnetic materials used in practical designs. This study is focused on interleaved boost converter of integrated winding coupled inductors, loose-coupled inductors and non-coupled inductors. The study is discussed from the view point of inductor losses and inductor volume.
  • Keywords
    DC-DC power convertors; automotive electronics; inductors; magnetic materials; thermal analysis; automotive applications; electric vehicles; heat volume; high power density DC-DC converters; hybrid vehicles; inductor loss analysis; inductor volume; integrated winding coupled inductors; interleaved boost converters; magnetic component miniaturization; magnetic designs; magnetic materials; optimal magnetic property selection; thermal analysis; Core loss; Inductors; Magnetic cores; Magnetic flux; Materials; Temperature measurement; Windings;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953505
  • Filename
    6953505