DocumentCode
1504964
Title
Decentralized control of wafer temperature for multizone rapid thermal processing systems
Author
Schaper, Charles D. ; Kailath, Thomas ; Lee, Yong Jin
Author_Institution
Dept. of Electr. Eng., Stanford Univ., CA, USA
Volume
12
Issue
2
fYear
1999
fDate
5/1/1999 12:00:00 AM
Firstpage
193
Lastpage
199
Abstract
Decentralized control is shown through analysis and experimentation to be an appropriate strategy for wafer temperature control in certain multizone rapid thermal processing (RTP) systems. An input-output controllability analysis is conducted to illustrate that the direction associated with the reference command (set-point) corresponding to a spatially uniform temperature trajectory specification is nearly in alignment with the “most” controllable direction associated with the maximum singular value for a multiple concentric lamp configuration. Consequently, the control structure need not alter the directionality of the plant and, thus, can be achieved by a simple decentralized controller where the lamps are paired individually to sensors to achieve a multiloop structure where all interactions are not taken explicitly into account. This result is shown to produce acceptable performance even for an ill-conditioned plant since the directions corresponding to the smaller singular values are irrelevant to the uniform temperature control criteria. Moreover, straightforward nonmodel-based tuning of the controller is enabled due to the simplicity of the decentralized control structure
Keywords
controllability; decentralised control; process control; rapid thermal processing; temperature control; decentralized control; input-output controllability analysis; multizone rapid thermal processing system; semiconductor manufacturing; wafer temperature; Automatic control; Controllability; Distributed control; Heating; Lamps; Optimal control; Rapid thermal processing; Temperature control; Temperature distribution; Temperature measurement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.762877
Filename
762877
Link To Document