• DocumentCode
    1507187
  • Title

    High-density data storage based on the atomic force microscope

  • Author

    Mamin, H. Jonathon ; Ried, Robert P. ; Terris, Bruce D. ; Rugar, Daniel

  • Author_Institution
    Res. Div., IBM Corp., San Jose, CA, USA
  • Volume
    87
  • Issue
    6
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    1014
  • Lastpage
    1027
  • Abstract
    The atomic force microscope (AFM), with its ability to image and modify surfaces on the nanometer scale, offers the potential for simple, compact, high-density data storage devices. At the heart of the technique is a microfabricated cantilever with a sharp tip on the end. Using modern micromachining techniques, it is possible to batch fabricate cantilevers with tips that are sharp on the scale of 100 Å. We have pursued a particular AFM storage scheme based on mechanical readback of topographic data using high-frequency piezoresistive silicon cantilevers. Areal densities of 65 Gbit/in2 have been demonstrated, with readback rates greater than 10 Mbit/s. Nanoreplication techniques have been used to produce read-only disks. In addition, a write-once scheme was developed that uses integrated heating elements on the cantilevers in order to perform thermomechanical writing on a polymer substrate. Considerable progress has been made in addressing critical issues such as data rate, reliability, and practical implementation, but significant challenges still remain, both in the technology and in finding the most suitable applications
  • Keywords
    atomic force microscopy; elemental semiconductors; micromachining; micromechanical devices; piezoresistive devices; semiconductor device reliability; semiconductor storage; silicon; 10 Mbit/s; 100 angstrom; Si; areal densities; atomic force microscope; data rate; high-density data storage; high-frequency piezoresistive cantilevers; integrated heating elements; mechanical readback; microfabricated cantilever; micromachining techniques; nanoreplication techniques; read-only disks; readback rates; reliability; thermomechanical writing; topographic data; write-once scheme; Atomic force microscopy; Heart; Heating; Memory; Micromachining; Nanoscale devices; Piezoresistance; Silicon; Surface topography; Thermomechanical processes;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.763314
  • Filename
    763314