• DocumentCode
    1508050
  • Title

    Effect of Ion Energy on Power MOSFET´s Oxide Reliability

  • Author

    Naceur, M. ; Touboul, A.D. ; Vaille, J.R. ; Lorfèvre, E. ; Bezerra, F. ; Chaumont, G. ; Saigné, F.

  • Author_Institution
    Institut d´´Electronique du Sud, Université Montpellier 2, UMR UM2-CNRS 5214, Montpellier, France
  • Volume
    59
  • Issue
    4
  • fYear
    2012
  • Firstpage
    786
  • Lastpage
    791
  • Abstract
    Heavy ion-induced Power MOSFET´s reliability degradation has been studied. Irradiations were realized at low and high energy with the same electronic stopping power at the surface of the die. For both energies, a decrease of the charge to breakdown has been observed after irradiation. However, an enhanced degradation of the oxide layer reliability is observed at low energy. The lifetime reduction at high energy is correlated to local disorder along the ion track that can act as precursor damage. On the other hand, the most important reliability degradation at low energy is attributed to a synergy effect between ionizing and non-ionizing processes. Clusters of defects can indeed be formed, adding an additional wear-out mechanism. These results may be significant in the frame of Single Event Testing
  • Keywords
    Degradation; Electric breakdown; Logic gates; Power MOSFET; Radiation effects; Reliability; Stress; Charge to breakdown; High Electrical Field Stress (HEFS); Linear Energy Transfer (LET); Non Ionizing Energy Loss (NIEL); heavy ions; latent defect; power MOSFET; structural modifications; time to breakdown;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2012.2192751
  • Filename
    6194357