• DocumentCode
    151030
  • Title

    A temperature dependent simple spice based modeling platform for power IGBT modules

  • Author

    Sfakianakis, Georgios ; Nawaz, Muhammad ; Chimento, Filippo

  • Author_Institution
    Dept. of Electr. Eng., Electromech. & Power Electron. group, Eindhoven Univ. of Technol., Eindhoven, Netherlands
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    2873
  • Lastpage
    2879
  • Abstract
    This paper deals with the development of a PSpice based temperature dependent modelling platform for the evaluation of silicon based IGBT power modules. The developed device modelling platform is intended to be used for the design and assessment of converter valves/cells for potential high power applications in transmission and distribution networks. An extended version of a previous modelling platform implemented in PSpice is presented here taking into account temperature dependence up to (and even beyond) the specified junction temperature of 125°C of 4.5kV StakPak power modules. A set of device modelling parameters (both for IGBTs and diodes) have first been extracted and verified with static and dynamic comparison of experimental data from 4.5kV and 2.0kA Si based IGBT power modules. An overall fair comparison is achieved with varying set of bus voltages and load currents and at different temperatures.
  • Keywords
    SPICE; insulated gate bipolar transistors; power semiconductor devices; bus voltages; converter cells; converter valves; current 2 kA; distribution networks; load currents; power IGBT modules; temperature 125 degC; temperature dependent simple Spice based modeling platform; transmission networks; voltage 4.5 kV; Insulated gate bipolar transistors; Integrated circuit modeling; Load modeling; Logic gates; Mathematical model; Multichip modules; Temperature dependence; Device Modeling; IGBTs; Power Semiconductor Modules; Semiconductor Devices; Spice Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953788
  • Filename
    6953788