DocumentCode
1510400
Title
Interconnects in VLSI design [Book Review]
Volume
17
Issue
3
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
57
Lastpage
57
Keywords
Assembly; Book reviews; Cost function; Integrated circuit interconnections; Integrated circuit modeling; Manufacturing; Packaging; Photonics; Temperature sensors; Very large scale integration;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/MCD.2001.933800
Filename
933800
Link To Document