• DocumentCode
    151088
  • Title

    Rogowski current sensor design and analysis based on printed circuit boards (PCB)

  • Author

    Ruxi Wang ; Prabhakaran, Suraj ; Burdick, Williams ; Nicholas, Raymond

  • Author_Institution
    Gen. Electr. Global Res., Niskayuna, NY, USA
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    3206
  • Lastpage
    3211
  • Abstract
    This work presents a new Rogowski current sensor design implemented in printed circuit boards. The proposed structure utilizes a modular design for a variety of applications. Feasibility was first demonstrated using standard printed circuit boards. Test results detail performance with high repeatability with less than 0.8% difference in sensed voltages and less than 0.3% difference in sensed voltages with respect to position of installation. In order to have a less complex, more manufacturable and modular Rogowski current sensor, a flexible printed circuit (FPC) solution was also designed and demonstrated. By using the FPC solution, high sensitivity and much higher power density was achieved. Coupling analysis of a 3-phase system was also conducted both from simulation and experiments.
  • Keywords
    electric sensing devices; printed circuits; sensitivity; 3-phase system; FPC solution; PCB; Rogowski current sensor analysis; Rogowski current sensor design; coupling analysis; flexible printed circuit Board; power density; Assembly; Coils; Conductors; Couplings; Flexible printed circuits; Sensitivity; Spirals; Current Sensing; Flexible PCB; High Repeatability; Rigid PCB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953836
  • Filename
    6953836