DocumentCode
1515994
Title
Modeling differential via holes
Author
Laermans, Eric ; De Geest, Jan ; De Zutter, Daniël ; Olyslager, Frank ; Sercu, Stefaan ; Morlion, Danny
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Belgium
Volume
24
Issue
3
fYear
2001
fDate
8/1/2001 12:00:00 AM
Firstpage
357
Lastpage
363
Abstract
In this paper, we present a method to characterize differential via holes in printed circuit boards in a both fast and accurate way. The via hole is modeled as a cascade of capacitances and inductances. We use FASTCAP to compute the values of the capacitances, and a closed form formula to obtain the inductance values. The numerical predictions are compared with experimental data
Keywords
capacitance; circuit layout CAD; circuit simulation; inductance; printed circuit layout; FASTCAP; capacitances; closed form formula; differential via holes; inductances; numerical predictions; printed circuit boards; Capacitance; Connectors; Frequency; Inductance; Integrated circuit interconnections; Interference; Printed circuits; Reflection; Signal analysis; Signal design;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.938303
Filename
938303
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