DocumentCode
1516611
Title
Packages go vertical
Author
Goldstein, Harry
Volume
38
Issue
8
fYear
2001
fDate
8/1/2001 12:00:00 AM
Firstpage
46
Lastpage
51
Abstract
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
Keywords
cellular radio; hearing aids; integrated circuit packaging; portable computers; cell phones; chip stacking; hearing aids; implantable devices; integrated circuits; vertical packaging; wearable computers; Cellular phones; Chip scale packaging; Hearing aids; Integrated circuit interconnections; Packaging machines; Power system interconnection; Stacking; System-on-a-chip; Wearable computers; Wireless communication;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.938714
Filename
938714
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