Passive alignment of single-mode fibers to integrated polymer waveguide structures utilizing a single-mask process

Author

Moosburger, R. ; Hauffe, R. ; Siebel, U. ; Arndt, D. ; Kropp, J. ; Petermann, K.

Author_Institution

Fachgebiet Hochfrequenztech., Tech. Univ. Berlin, Germany

Volume

11

Issue

7

fYear

1999

fDate

7/1/1999 12:00:00 AM

Firstpage

848

Lastpage

850

Abstract

A fabrication process for high precision passive fiber chip coupling is presented. The difficulties of structuring highly nonplanar surfaces were solved by using an electrophoretic photoresist and introducing additional structures to prevent wide holes. The method involves only a single lithographic step for structuring the polymer waveguide and fiber aligning structures in Si and thereby minimizing the horizontal displacement. The loss due to fiber displacement is about 0.7 dB per front face.

Keywords

integrated optics; optical couplers; optical fabrication; optical fibre couplers; photolithography; 0.7 dB; Si; additional structures; electrophoretic photoresist; fabrication process; fiber aligning structures; fiber displacement; high precision passive fiber chip coupling; horizontal displacement; integrated polymer waveguide structures; passive alignment; polymer waveguide; single lithographic step; single-mask process; single-mode fiber coupling; structuring highly nonplanar surfaces; wide holes; Etching; Optical device fabrication; Optical devices; Optical fiber devices; Optical fibers; Optical polymers; Optical surface waves; Optical waveguides; Resists; Silicon;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.769728

Filename

769728