Effects of gaps and bypass capacitors on interconnect of PCB with multilayered geometry

A microstrip with gap discontinuity and bypass capacitors on the ground plane for interconnects in multilayered digital circuits is analysed. The approach is based on integral equations using the spatial-domain magnetic field Green´s function in a layered medium. The method of moment solution is obtained with RWG basis functions and Galerkin testing. The method is applied to gaps with bypass capacitors in single and double layer structures. Simulation results are obtained for various values and locations of bypass capacitors and for the case of a second reference plane. The effects of bypass capacitors and a second reference plane are analysed based on the simulation results. Numerical results give a quantitative description of the reduction in inductance created by the gap with bypass capacitors and a second reference plane