Thin-film silicon solar cells using an adhesive bonding technique

Author

Takato, Hidetaka ; Shimokawa, Ryuichi

Author_Institution

Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan

Volume

48

Issue

9

fYear

2001

fDate

9/1/2001 12:00:00 AM

Firstpage

2090

Lastpage

2094

Abstract

Thin-film silicon solar cells using an adhesive bonding technique have been investigated. Surface passivation effect due to the developed adhesive is observed and a very low surface recombination velocity is obtained. A 10-μm-thick single-crystalline silicon solar cell is fabricated by adhesive bonding of a near-Lambertian alumina ceramic substrate. Open circuit voltage of 602 mV and short circuit current of 25.8 mA/cm² are obtained. Incident light is effectively confined by the adhesive bonding technique. The results obtained indicate that the adhesive bonding technique is suitable for realizing high-efficiency, low-cost, thin-film cell

Keywords

adhesion; elemental semiconductors; passivation; semiconductor thin films; silicon; solar cells; surface recombination; 602 mV; Al₂O₃; Si; adhesive bonding; near-Lambertian alumina ceramic substrate; open circuit voltage; optical confinement; short circuit current; single crystalline silicon; surface passivation; surface recombination velocity; thin film solar cell; Bonding; Ceramics; Passivation; Photovoltaic cells; Semiconductor thin films; Short circuit currents; Silicon; Substrates; Thin film circuits; Voltage;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.944200

Filename

944200