• DocumentCode
    1522740
  • Title

    Investigation of the DC breakdown mechanism in elastic syntactic foams

  • Author

    Kessler, M. ; Schnettler, A.

  • Author_Institution
    Inst. for High Voltage Technol., RWTH Aachen Univ., Aachen, Germany
  • Volume
    17
  • Issue
    3
  • fYear
    2010
  • fDate
    6/1/2010 12:00:00 AM
  • Firstpage
    898
  • Lastpage
    905
  • Abstract
    Modern insulation systems have to become more compact, less massive and environmentally acceptable. Elastic syntactic foams represent a multifunctional, elastic and compressible hybrid insulation material with a low density and a strong adhesion to polymers and metals. This kind of ´elastic foam´ consists of a silicone gel and polymeric microspheres in a range of several 10 μm used as filler, which are often additionally coated with CaCO3. Elastic syntactic foams are increasingly used for power transmission equipment and also dc applications e.g. in cable terminations. This paper deals with the breakdown mechanisms under short- and long-term dc stress. Therefore, electrical and optical investigations, as well as field simulations on this insulation material have been carried out. The results should serve as a basis to develop design criteria for such dc insulation systems. It is found that coating the spheres improves the dielectric strength of this insulation material. Variation of the filling degree also influences the electrical properties. The discharge process itself takes place in the silicone gel due to field displacements caused by the microspheres.
  • Keywords
    Adhesives; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Inorganic materials; Optical materials; Plastic insulation; Polymer films; Polymer foams; Polymer gels; Electric breakdown, electric variables measurement, silicone insulation;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2010.5492264
  • Filename
    5492264