Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

Author

Carchon, Geert ; Vaesen, Kristof ; Brebels, Steven ; De Raedt, Walter ; Beyne, Eric ; Nauwelaers, Bart

Author_Institution

MCP-HDIP Dept., IMEC, Heverlee, Belgium

Volume

24

Issue

3

fYear

2001

fDate

9/1/2001 12:00:00 AM

Firstpage

510

Lastpage

519

Abstract

Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high quality dielectrics and copper metallization, high quality transmission lines and inductors are available. This, together with the integrated passives design library containing scalable equivalent models for the inductors, capacitors, resistors, transmission lines and discontinuities, allows easy and accurate co-design between the passive and active devices. Examples of bandpass filters, power dividers, quadrature couplers, microwave feedthroughs, a DECT VCO and a 14 GHz LNA are given

Keywords

microwave integrated circuits; multichip modules; 14 GHz; Cu; DECT VCO; LNA; RF circuit; active device; bandpass filter; capacitor; copper metallization; dielectric material; discontinuity; inductor; integrated passives design library; microwave circuit; microwave feedthrough; passive device; power divider; quadrature coupler; resistor; system-in-a-package; thin-film multilayer MCM-D technology; transmission line; wireless front-end system; Copper; Dielectric thin films; Libraries; Metallization; Nonhomogeneous media; Packaging; Power system modeling; Power transmission lines; Thin film inductors; Transistors;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.946500

Filename

946500