Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes

Author

Yan, Bohan ; You, Jiun Pyng ; Tran, Nguyen T. ; He, Yongzhi ; Shi, Frank G.

Author_Institution

Optoelectron. Packaging & Mater. Labs., Univ. of California, Irvine, Irvine, CA, USA

Volume

33

Issue

4

fYear

2010

Firstpage

722

Lastpage

727

Abstract

In this paper, the influence of the die attach adhesive (DAA) layer on the thermal performance of high power light emitting diodes was first investigated by using finite element analysis, and some key results were verified by the experimental data. Effective thermal management of the studied light emitting diode package can be achieved by selecting a DAA material with a proper thermal conductivity and by manipulating the geometry parameters of the DAA layer, such as the DAA area, and the bond-line thickness. The significance of DAA thermal conductivity to heat dissipation was further demonstrated by an analysis of the bottleneck to heat transfer.

Keywords

adhesives; cooling; finite element analysis; light emitting diodes; thermal conductivity; thermal management (packaging); bond-line thickness; die attach adhesive layer; finite element analysis; heat dissipation; heat transfer; high power light emitting diodes; thermal conductivity; thermal management; thermal performance; Conducting materials; Finite element methods; Geometry; Heat transfer; Light emitting diodes; Microassembly; Packaging; Performance analysis; Thermal conductivity; Thermal management; Die attach material; finite element analysis; light emitting diodes; thermal performance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2009.2032097

Filename

5299256