Strength and flexibility of bulk high-T/sub c/ superconductors

Author

Goretta, K.C. ; Ming Jiang ; Kupperman, D.S. ; Lanagan, M.T. ; Singh, J.P. ; Vasanthamohan, N. ; Hinks, D.G. ; Mitchell, J.F. ; Richardson, J.W., Jr.

Author_Institution

Div. of Energy Technol., Argonne Nat. Lab., IL, USA

Volume

7

Issue

2

fYear

1997

fDate

6/1/1997 12:00:00 AM

Firstpage

1307

Lastpage

1310

Abstract

Strength, fracture toughness, and elastic modulus data for bulk high-temperature superconductors, commercial 99.9% Ag, and a 1.2 at.% Mg/Ag alloy have been collected. These data have been used to calculate fracture strains for bulk conductors. The calculations indicate that the superconducting cores of clad tapes should begin to fracture at strains below 0.2%. In addition, residual strains in Ag-clad (Bi,Pb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tapes have been measured by neutron diffraction. An explanation is offered for why many tapes appear to be able to tolerate large strains before exhibiting a reduction in current transport.

Keywords

barium compounds; bismuth compounds; calcium compounds; composite superconductors; elastic moduli; fracture toughness; high-temperature superconductors; lead compounds; mechanical strength; neutron diffraction; silver; strontium compounds; superconducting tapes; thallium compounds; yttrium compounds; (BiPb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag; Ag; Ag-clad (Bi,Pb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tapes; Mg/Ag alloy; bulk high-T/sub c/ superconductors; clad tapes; current transport reduction; elastic modulus; flexibility; fracture strains; fracture toughness; high-temperature superconductors; neutron diffraction; residual strains; strength; superconducting cores; Capacitive sensors; Conducting materials; Diffraction; High temperature superconductors; Laboratories; Materials science and technology; Neutrons; Strain measurement; Superconductivity; Testing;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.620765

Filename

620765