Visco-elastic-plastic properties and constitutive modeling of underfills

Author

Qian, Zhengfang ; Wang, Jianjun ; Yang, Jian ; Liu, Sheng

Author_Institution

Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

152

Lastpage

157

Abstract

The thermo-mechanical testing of HYSOL PP4526 underfill is reported, including the details of sample preparation and test procedures. It is found that the Young´s modulus of the underfill depends on both temperature and applied strain rate. The constitutive framework proposed for solder alloys has been applied successfully to model the thermo-mechanical properties of the underfill in this paper. Excellent agreement between model predictions and experimental data is achieved, The test data and calibrated constitutive model can be used for the analysis and design of advanced electronic packages with underfills such as flip-chip packages

Keywords

Young´s modulus; encapsulation; flip-chip devices; integrated circuit packaging; viscoelasticity; viscoplasticity; HYSOL PP4526; Young´s modulus; applied strain rate; calibrated constitutive model; constitutive modeling; electronic packages; flip-chip packages; model predictions; sample preparation; test procedures; thermo-mechanical testing; underfills; visco-elastic-plastic properties; Capacitive sensors; Curing; Electronic packaging thermal management; Electronics packaging; Mechanical factors; Plastic packaging; Polymers; Soldering; Testing; Thermomechanical processes;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774721

Filename

774721