Development of reworkable underfills, materials, reliability and processing

Author

Chane, L. ; Torres-Filho, Afranio ; Ober, Christopher K. ; Yang, Shu ; Chen, Jir-Shyr ; Johnson, R. Wayne

Author_Institution

Loctite Corp., Rocky Hill, CT, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

163

Lastpage

167

Abstract

The rework of packages is a standard practice in surface mount technology (SMT) assembly. The reasons for rework include process yields, failed parts, and field returns. The implementation of flipchip has been hindered by the lack of reworkability following underfill cure. Current commercial underfills do not allow for the rework of the flipchip. The development of a reworkable underfill is described in this paper. The materials selection process, information on the process for rework as well as pertinent reliability data are described

Keywords

encapsulation; flip-chip devices; integrated circuit reliability; integrated circuit yield; surface mount technology; SMT; failed parts; field returns; materials selection process; process yields; reliability; reliability data; reworkable underfills; underfill cure; Assembly; Chip scale packaging; Cranes; Electronics packaging; Integrated circuit packaging; Materials reliability; Resins; Space technology; Surface-mount technology; Temperature;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774724

Filename

774724