• DocumentCode
    1528523
  • Title

    Gasping the impact of on-chip inductance

  • Author

    Massoud, Yehia ; Ismail, Yehea

  • Volume
    17
  • Issue
    4
  • fYear
    2001
  • fDate
    7/1/2001 12:00:00 AM
  • Firstpage
    14
  • Lastpage
    21
  • Abstract
    The rapid advancements in process technology and heightening market pressures for functional integration are resulting in large VLSI chips operating at steadily increasing frequencies. The number of long global wires per chip has been continuously increasing with time. These wires carry high-frequency currents and have low resistance. This low resistance is due to the use of thick and wide interconnects at higher metal layers. Additionally, superior conducting materials such as copper have been introduced in order to keep the resistance and the RC delay of global lines small. These factors have led to a continuous increase in the importance of inductance, which has emerged as a standard factor that designers must take into consideration when designing high-performance chips in deep-submicron technologies. In this paper, the authors briefly discuss the importance, physical nature, effects, and extraction issues of on-chip inductance. Understanding the effects of on-chip inductance in high-speed integrated circuits is crucial to high-performance design
  • Keywords
    VLSI; crosstalk; delay estimation; digital integrated circuits; high-speed integrated circuits; inductance; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; RC delay; VLSI chips; deep-submicron technologies; high-performance chips; high-performance design; high-speed integrated circuits; inductance extraction; inductance modelling; interconnects; onchip inductance; Conducting materials; Copper; Delay lines; Frequency; High speed integrated circuits; Inductance; Integrated circuit interconnections; Integrated circuit technology; Very large scale integration; Wires;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.950046
  • Filename
    950046