• DocumentCode
    1538983
  • Title

    Deep submicron microprocessor design issues

  • Author

    Flynn, Michael J. ; Hung, Patrick ; Rudd, Kevin W.

  • Author_Institution
    Stanford Univ., CA, USA
  • Volume
    19
  • Issue
    4
  • fYear
    1999
  • Firstpage
    11
  • Lastpage
    22
  • Abstract
    Deep-submicron technology allows billions of transistors on a single die, potentially running at gigahertz frequencies. According to Semiconductor Industry Association (SIA) projections, the number of transistors per chip and the local clock frequencies for high-performance microprocessors will continue to grow exponentially in the near future. This ensures that future microprocessors will become ever more complex. However, physical and program behavioral constraints will limit the usefulness of this complexity. Physical constraints include interconnect and device limits, as well as practical limits on power and cost. Program behavioral constraints result from program control and data dependencies, and from unpredictable events during execution. Other challenges include the need for advanced CAD tools to combat the negative effect of greater complexity on design time. Designers will also have to make improvements to preserve computational integrity, reliability, and diagnostic features. Successful implementations will depend on the processor architect´s ability to foresee technology trends and understand the changing design trade-offs for specific applications, beginning with the differing requirements for client versus server processors. This article discusses these trade-offs in light of industry projections and the many considerations affecting deep submicron technology
  • Keywords
    computational complexity; microprocessor chips; program control structures; complexity; computational integrity; data dependencies; deep submicron microprocessor design issues; diagnostic features; high-performance microprocessors; local clock frequencies; program control; reliability; Algorithm design and analysis; Capacitance; Clocks; Copper; Delay; Dielectrics; Metal-insulator structures; Microprocessors; Space technology; Wire;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/40.782563
  • Filename
    782563