DocumentCode
1541058
Title
Thin-film circuit technology: Part I — Thin-film R-C networks
Author
Lessor, A.E. ; Maissel, L.I. ; Thun, R.E.
Author_Institution
International Business Machines Corporation
Volume
1
Issue
4
fYear
1964
fDate
4/1/1964 12:00:00 AM
Firstpage
72
Lastpage
80
Abstract
Miniaturization requirements have brought about the integral fabrication of many components. The thin-film approach permits the integration of numerous precision circuit elements and their interconnections. Part I of this three-part series deals mainly with the two deposition techniques of cathode sputtering and vacuum evaporation, and with their use in the fabrication of film resistors, capacitors, and R-C networks. Subsequent articles will discuss thin-film transistors and cryogenic thin films Part I — Thin-film R-C networks
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.1964.6500525
Filename
6500525
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