• DocumentCode
    1541058
  • Title

    Thin-film circuit technology: Part I — Thin-film R-C networks

  • Author

    Lessor, A.E. ; Maissel, L.I. ; Thun, R.E.

  • Author_Institution
    International Business Machines Corporation
  • Volume
    1
  • Issue
    4
  • fYear
    1964
  • fDate
    4/1/1964 12:00:00 AM
  • Firstpage
    72
  • Lastpage
    80
  • Abstract
    Miniaturization requirements have brought about the integral fabrication of many components. The thin-film approach permits the integration of numerous precision circuit elements and their interconnections. Part I of this three-part series deals mainly with the two deposition techniques of cathode sputtering and vacuum evaporation, and with their use in the fabrication of film resistors, capacitors, and R-C networks. Subsequent articles will discuss thin-film transistors and cryogenic thin films Part I — Thin-film R-C networks
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.1964.6500525
  • Filename
    6500525