DocumentCode
154154
Title
Table of contents
fYear
2014
fDate
20-23 May 2014
Firstpage
1
Lastpage
10
Abstract
The following topics are dealt with: integrated circuit interconnection; 3D integration; reliability; process integration; materials and unit process; and carbon nanotubes.
Keywords
carbon nanotubes; integrated circuit interconnections; reliability; three-dimensional integrated circuits; 3D integration; carbon nanotubes; integrated circuit interconnection; materials; process integration; reliability; unit process;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-5016-4
Type
conf
DOI
10.1109/IITC.2014.6831824
Filename
6831824
Link To Document