• DocumentCode
    154164
  • Title

    Thanks

  • fYear
    2014
  • fDate
    20-23 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
  • Conference_Location
    San Hose, CA, USA
  • Print_ISBN
    978-1-4799-5016-4
  • Type

    conf

  • DOI
    10.1109/IITC.2014.6831829
  • Filename
    6831829