Wire bond pull test and its correct uses

This paper will be focus on the equilibrium principal of force and mathematical proof to establish a quantitative mathematical mode of bond pull strength in two wires. Further the correct hook position is quantitatively derived. This paper also defines a new parameter-Normalized Hook Position (NHP) which provides a more convenient and practiced method to locate the correct hook position. Finally as an engineering application of the mode, the adhesive strengths (peel resistances) exerted on the wire bonds were calculated quantitatively and simultaneously during destructive bond pull test.