• DocumentCode
    1543449
  • Title

    Microelectronic fabrication: An examination of the ever growing struggle to get smaller

  • Author

    Jaeger, Richard C.

  • Author_Institution
    Auburn Univ., AL, USA
  • Volume
    6
  • Issue
    2
  • fYear
    1987
  • fDate
    5/1/1987 12:00:00 AM
  • Firstpage
    33
  • Lastpage
    36
  • Abstract
    An overview of integrated circuit fabrication basics is given. Materials for integrated circuits are discussed, and device structures and fabrication processes are examined. The growth in fabrication complexity is illustrated by comparing the classic junction-isolated bipolar technology with that of a state-of-the-art oxide isolated bipolar device. The basic processing steps are described. Advanced structures are briefly considered.
  • Keywords
    integrated circuit manufacture; integrated circuit technology; device structures; fabrication processes; integrated circuit fabrication; junction-isolated bipolar technology; oxide isolated bipolar device; Fabrication; Gallium arsenide; Microelectronics; Random access memory; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Potentials, IEEE
  • Publisher
    ieee
  • ISSN
    0278-6648
  • Type

    jour

  • DOI
    10.1109/MP.1987.6500929
  • Filename
    6500929
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1543449