DocumentCode
1546218
Title
Real-time diagnosis of semiconductor manufacturing equipment using a hybrid neural network expert system
Author
Kim, Byungwhan ; May, Gary S.
Author_Institution
Dept. of Equipment Eng., Hyundai Electron. Ind. Co. Ltd., South Korea
Volume
20
Issue
1
fYear
1997
fDate
1/1/1997 12:00:00 AM
Firstpage
39
Lastpage
47
Abstract
This paper presents a tool for the real-time diagnosis of integrated circuit fabrication equipment. The approach focuses on integrating neural networks into an expert system. The system employs evidential reasoning to identify malfunctions by combining evidence originating from equipment maintenance history, on-line sensor data, and in-line post-process measurements. Neural networks are used in the maintenance phase of diagnosis to approximate the functional form of the failure history distribution of each component. Predicted failure rates are then converted to belief levels. For on-line diagnosis in the ease of previously unencountered faults, a CUSUM control chart is implemented on real sensor data to detect very small process shifts and their trends. For the known fault case, continuous hypothesis testing on the statistical mean and variance of the sensor data is performed to search for similar data patterns and assign belief levels. Finally, neural process models of process figures of merit (such as etch uniformity) derived from prior experimentation are used to analyze the in-line measurements, and identify the most suitable candidate among faulty input parameters (such as gas flow) to explain process shifts. A working prototype for this hybrid diagnostic system has been implemented on the Plasma Therm 700 series reactive ion etcher located in the Georgia Tech Microelectronics Research Center
Keywords
belief maintenance; case-based reasoning; diagnostic expert systems; fault diagnosis; integrated circuit manufacture; maintenance engineering; neural nets; real-time systems; sputter etching; CUSUM control chart; Plasma Therm 700 series; belief levels; continuous hypothesis testing; equipment maintenance history; etch uniformity; evidential reasoning; failure history distribution; failure rates; hybrid neural network expert system; in-line post-process measurements; integrated circuit fabrication; on-line sensor data; process figures of merit; process shifts; reactive ion etcher; real-time diagnosis; semiconductor manufacturing equipment; Circuit faults; Diagnostic expert systems; Etching; Fabrication; Fault diagnosis; History; Neural networks; Plasma measurements; Semiconductor device manufacture; Sensor systems;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher
ieee
ISSN
1083-4400
Type
jour
DOI
10.1109/3476.585143
Filename
585143
Link To Document