S-parameter based technique for simultaneous switching noise analysis in electronic packages

Author

Jin, Zhang ; Iyer, Mahadevan K. ; Qiu, Youlin ; Ooi, Ban-Leong ; Leong, Mook-Seng

Author_Institution

Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

267

Lastpage

273

Abstract

A method based on S-parameters is developed for the analysis of simultaneous switching noise (SSN) in electronic packages. A two-port Z matrix of the package pin/trace, and the coupling between the pins/traces are modeled by analytical equations. SSN is analyzed as a function of the number of switching drivers and switching time. Frequency domain measurements are performed to demonstrate the accuracy of the model. The modeling methodology is applied to both leaded and area array packages

Keywords

S-parameters; frequency-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; plastic packaging; S-parameter based technique; area array packages; electronic packages; frequency domain measurements; leaded packages; package pin/trace; simultaneous switching noise analysis; switching drivers; switching time; two-port Z matrix; Circuit noise; Crosstalk; Electronics packaging; Frequency domain analysis; Frequency measurement; Pins; Plastic packaging; Scattering parameters; Semiconductor device modeling; Transmission line discontinuities;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784474

Filename

784474