DocumentCode
1547138
Title
Power semiconductors: Looking ahead: Consumer applications will grow for moderate-current devices while large-diameter wafers await packaging innovations
Author
Harnden, J.D.
Author_Institution
General Electric Co., Schenectady, NY, USA
Volume
14
Issue
8
fYear
1977
Firstpage
40
Lastpage
46
Abstract
The article underlines the role of Czochralski material in the manufacture and continues to suggest that the need for a more efficient packaging development. Comparisons are made between power transistors and thyristors together with prediction charts for power ratings and operating times. An insert is also given covering the tools and processes used in the device manufacture.
Keywords
power transistors; thyristors; Czochralski material; device manufacture; efficient packaging; operating times; power ratings; power transistors; thyristors;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.1977.6501555
Filename
6501555
Link To Document