• DocumentCode
    1547138
  • Title

    Power semiconductors: Looking ahead: Consumer applications will grow for moderate-current devices while large-diameter wafers await packaging innovations

  • Author

    Harnden, J.D.

  • Author_Institution
    General Electric Co., Schenectady, NY, USA
  • Volume
    14
  • Issue
    8
  • fYear
    1977
  • Firstpage
    40
  • Lastpage
    46
  • Abstract
    The article underlines the role of Czochralski material in the manufacture and continues to suggest that the need for a more efficient packaging development. Comparisons are made between power transistors and thyristors together with prediction charts for power ratings and operating times. An insert is also given covering the tools and processes used in the device manufacture.
  • Keywords
    power transistors; thyristors; Czochralski material; device manufacture; efficient packaging; operating times; power ratings; power transistors; thyristors;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.1977.6501555
  • Filename
    6501555