Finite element analysis of PWB warpage due to the solder masking process

Author

Ume, I. Charles ; Martin, Timothy ; Gatro, Jeffrey T.

Author_Institution

Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

20

Issue

3

fYear

1997

fDate

9/1/1997 12:00:00 AM

Firstpage

295

Lastpage

306

Abstract

Researchers have begun to examine the various manufacturing processes that a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering process to determine their impact on board warpage. The goal of this paper is to determine effects of the solder masking process on the PWB warpage. Finite element analysis was used to study the effects of the solder masking process, in particular the curtain coating and curing processes on PWB warpage of four different board designs. These analyses have aided development of general guidelines that should be observed when selecting solder masking material

Keywords

assembling; buckling; finite element analysis; masks; printed circuit manufacture; soldering; PWB warpage; board warpage; curing processes; curtain coating; finite element analysis; manufacturing processes; masking material; solder masking; solder masking process; soldering process; Assembly; Automobile manufacture; Circuits; Computer industry; Copper; Finite element methods; Manufacturing processes; Production; Soldering; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.623024

Filename

623024