Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis

Author

Ume, I. Charles ; Martin, Timothy

Author_Institution

Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

20

Issue

3

fYear

1997

fDate

9/1/1997 12:00:00 AM

Firstpage

307

Lastpage

316

Abstract

This paper describes the impact of different types of cured solder mask and mask thicknesses on printed wiring board (PWB) warpage. Finite element analysis (FEA) was used to study the sensitivity of board warpage to changes in the mask material properties (different types of solder mask), and to variations in mask thickness. The sensitivity analysis of the influence of cured solder mask and variations in mask thickness on PWB warpage are the focus of this paper. The study reported in this paper was carried out with four different board designs, and the results are presented here. The results of these analyses have resulted in general guidelines which should be observed when selecting masking materials

Keywords

buckling; finite element analysis; masks; printed circuit manufacture; sensitivity analysis; soldering; thermal expansion; PWB warpage; board designs; cured solder mask; finite element analysis; mask thicknesses; sensitivity analysis; Assembly; Components, packaging, and manufacturing technology; Copper; Dielectric materials; Fabrics; Finite element methods; Guidelines; Material properties; Thermal expansion; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.623025

Filename

623025