DocumentCode
1553008
Title
Comments on ´Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity´
Author
Krabbenhoft, K. ; Damkilde, L.
Author_Institution
Dept. of Civil Eng., Tech. Univ. Denmark, Lyngby, Denmark
Volume
37
Issue
24
fYear
2001
fDate
11/22/2001 12:00:00 AM
Firstpage
1481
Lastpage
1482
Abstract
Recently, a semi-analytical method for dealing with the transient diffusion equation for circuit simulation with temperature dependent thermal properties has been proposed by Batty and Snowden [see ibid., vol. 36, no. 23, p. 1966-8 (2000).]. However, in the derivation of the method a mistake is made which may lead to inaccurate results, especially in the case where the thermal properties vary strongly with the temperature. For the sake of convenience we shall consider the one dimensional diffusion equation without sources. The authors´ reply is included
Keywords
circuit simulation; thermal diffusivity; thermal resistance; transient analysis; circuit simulation; electro-thermal device; one dimensional diffusion equation; semi-analytical method; temperature dependent diffusivity; thermal nonlinearity; thermal properties; transient diffusion equation;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20010991
Filename
970407
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