• DocumentCode
    1556125
  • Title

    Development of prediction technique for cooling performance of finned heat sink in uniform flow

  • Author

    Sata, Yutaka ; Iwasaki, Hideo ; Ishizuka, Masaru

  • Author_Institution
    Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
  • Volume
    20
  • Issue
    2
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    160
  • Lastpage
    166
  • Abstract
    Numerical simulation was carried out on the flow and the temperature fields around a plate fin array subjected to a uniform flow, varying the ratio of fin length L to the half-pitch of fins s. As Re0s/L decreased, the flow approaching the fin array had a tendency to bypass it and thus the average flow velocity through fins U f became lower, where Re0 is the Reynolds number defined by uniform flow velocity and s. It was also found that frictional resistance and heat transfer of the fins showed excellent agreement with those for the developing flow between parallel plates with uniform inlet flow velocity equal to U. A prediction technique for the cooling performance of the fin array was developed in which Uf was estimated under the condition of constant pressure distribution at its downstream edge. The present technique can predict the heat transfer of the fin array with an error level below 30% under practical conditions of electronics design, although it underestimates U f in the region of small Re0s/L
  • Keywords
    cooling; electronic equipment testing; forced convection; heat sinks; packaging; Reynolds number; average flow velocity; constant pressure distribution; cooling performance; downstream edge; fin length; finned heat sink; frictional resistance; half-pitch; heat transfer; parallel plates; plate fin array; prediction technique; temperature fields; uniform flow; uniform flow velocity; Consumer electronics; Coolants; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Pressure control; Semiconductor device packaging; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.588568
  • Filename
    588568