DocumentCode
1556125
Title
Development of prediction technique for cooling performance of finned heat sink in uniform flow
Author
Sata, Yutaka ; Iwasaki, Hideo ; Ishizuka, Masaru
Author_Institution
Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
Volume
20
Issue
2
fYear
1997
fDate
6/1/1997 12:00:00 AM
Firstpage
160
Lastpage
166
Abstract
Numerical simulation was carried out on the flow and the temperature fields around a plate fin array subjected to a uniform flow, varying the ratio of fin length L to the half-pitch of fins s. As Re0s/L decreased, the flow approaching the fin array had a tendency to bypass it and thus the average flow velocity through fins U f became lower, where Re0 is the Reynolds number defined by uniform flow velocity and s. It was also found that frictional resistance and heat transfer of the fins showed excellent agreement with those for the developing flow between parallel plates with uniform inlet flow velocity equal to U. A prediction technique for the cooling performance of the fin array was developed in which Uf was estimated under the condition of constant pressure distribution at its downstream edge. The present technique can predict the heat transfer of the fin array with an error level below 30% under practical conditions of electronics design, although it underestimates U f in the region of small Re0s/L
Keywords
cooling; electronic equipment testing; forced convection; heat sinks; packaging; Reynolds number; average flow velocity; constant pressure distribution; cooling performance; downstream edge; fin length; finned heat sink; frictional resistance; half-pitch; heat transfer; parallel plates; plate fin array; prediction technique; temperature fields; uniform flow; uniform flow velocity; Consumer electronics; Coolants; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Pressure control; Semiconductor device packaging; Temperature; Thermal conductivity;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.588568
Filename
588568
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