Thermal analysis of GaAs power monolithic microwave IC´s mounted with epoxy attachment

Author

Nishihori, Kazuya ; Ishida, Kenji ; Kitaura, Yoshiaki ; Uchitomi, Naotaka

Author_Institution

ULSI Res. Center, Toshiba Corp., Kawasaki, Japan

Volume

20

Issue

2

fYear

1997

fDate

6/1/1997 12:00:00 AM

Firstpage

220

Lastpage

224

Abstract

The effect of chip-mounting attachment on the thermal resistance of GaAs power field effect transistor (FET) modules has been experimentally investigated. The thermal resistance was evaluated for different GaAs chip thickness of 150 and 250 μm through an electrical method utilizing temperature dependence of Schottky-barrier in the GaAs metal semiconductor FETs (MESFETs). The thermal resistance of low-cost epoxy-mounted GaAs chips, suitable for uniplanar monolithic microwave ICs (MMICs), was found not to increase even up to a chip thickness of 250 μm, while that of AuSn-mounted GaAs chips increased as was conventionally expected. Numerical simulation has also been presented for the similar case of GaAs power MMICs. The result of simulation suggests that lower thermal conductivity of attachment material, such as epoxy attachment, leads to larger optimum chip thickness that minimizes the total thermal resistance

Keywords

III-V semiconductors; MESFET integrated circuits; field effect MMIC; gallium arsenide; integrated circuit packaging; power integrated circuits; thermal analysis; thermal resistance; 150 micron; 250 micron; FET modules; GaAs; MESFETs; Schottky-barrier; chip thickness; chip-mounting attachment; epoxy attachment; power monolithic microwave ICs; thermal analysis; thermal conductivity; thermal resistance; Electric resistance; Gallium arsenide; MMICs; Microwave FET integrated circuits; Microwave FETs; Microwave integrated circuits; Monolithic integrated circuits; Temperature dependence; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.588577

Filename

588577