Parameter recharacterization: a method of thermal uprating

Author

Das, Diganta ; Pendsé, Neeraj ; Wilkinson, Chris ; Pecht, Michael G.

Author_Institution

CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA

Volume

24

Issue

4

fYear

2001

fDate

12/1/2001 12:00:00 AM

Firstpage

729

Lastpage

737

Abstract

The availability of electronic parts rated for operating temperature ranges wider than 0-70°C (commercial temperature range) is decreasing, as semiconductor manufacturers are prone to test and rate parts only in terms of "commercial" applications (e.g., consumer and computer products). Nevertheless, there is a need for parts requiring a larger operating temperature range, especially in avionics, military, automotive and oil drilling electronics. This paper presents a "parameter recharacterization" method for part use outside part manufacturer\´s specified temperature range. Cautions that need to be undertaken for successful parameter recharacterization are also presented

Keywords

characteristics measurement; conformance testing; integrated circuit testing; production testing; semiconductor device testing; electronic parts; operating temperature ranges; parameter conformance; parameter recharacterization; point selection; semiconductor manufacturers; stress balancing; thermal uprating; Aerospace electronics; Application software; Automotive engineering; Computer aided manufacturing; Electronic equipment testing; Military computing; Oil drilling; Semiconductor device manufacture; Semiconductor device testing; Temperature distribution;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.974967

Filename

974967