Very thin packaging of capped MEMS accelerometer device

Author

Lacsamana, E.S. ; Navarro, R.M. ; Mena, M.G. ; Felton, L.E. ; Webster, W.A.

Author_Institution

Micromachined Product Div., Analog Devices Inc., General Trias

Volume

1

fYear

2005

Abstract

Analog Devices Inc. (ADI) has been a major supplier of accelerometer devices in hermetic packages used for crash detection and vehicle dynamic control in the automotive industry. A major market pull from the handheld customers makes it imperative to develop thin plastic packaging solution for MEMS accelerometer. This paper details the backgrinding process developed to successfully thin the wafer-level-capped MEMS accelerometer. Functionality is maintained after packaging the thinned device, a significant effect in performance is observed. Three packaging solutions are evaluated to produce a 4times4times1 mm³ leadframe chip scale package (LFCSP). The performance of the thinned accelerometer device using the thin packaging options is compared. Assembly issues of the thin packages are also discussed

Keywords

accelerometers; assembling; chip scale packaging; micromechanical devices; backgrinding process; leadframe chip scale package; thin package assembling; thin plastic packaging; wafer level capped MEMS accelerometers; Accelerometers; Assembly; Automotive engineering; Chip scale packaging; Industrial control; Micromechanical devices; Plastic packaging; Vehicle crash testing; Vehicle detection; Vehicle dynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614374

Filename

1614374