Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Author

Yi-Shao Lai ; Chen, Kuo-Mmg ; Lee, Chiu-Wen ; Chin-Li Kao ; Shao, Yu-Hsiu

Author_Institution

Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung

Volume

2

fYear

2005

Abstract

We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite solder bumps in a flip-chip package assembly. The test vehicle is subjected to test conditions of five combinations of applied electric currents and ambient temperatures, namely, 0.4 A/150 degC, 0.5 A/150 degC, 0.6 A/125 degC, 0.6 A/135 degC, and 0.6 A/150 degC. An electrothermal coupling analysis is employed to investigate the current crowding effect and maximum temperature in the solder bump in order to correlate with the experimental reliability using the Black´s equation as a reliability model

Keywords

assembling; composite material interfaces; copper; copper alloys; electromigration; flip-chip devices; lead alloys; metallurgy; nickel; reliability; silver alloys; solders; tin alloys; titanium; 0.4 A; 0.5 A; 0.6 A; 125 C; 135 C; 150 C; Black equation; Sn-Pb; SnAgCu; Ti-Ni-Cu; ambient temperatures; composite flip-chip solder bumps; current crowding effect; electric currents; electromigration fatigue reliability; electromigration reliability; electrothermal coupling analysis; flip-chip package assembly; morphological patterns; solder bump; under bump metallurgy; Assembly; Current; Electromigration; Electrothermal effects; Fatigue; Packaging; Proximity effect; Temperature; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614505

Filename

1614505