DocumentCode
156384
Title
Heat absorption when soldering the microwave devices
Author
Shtennikov, V.N.
Author_Institution
Ural Fed. Univ. named after B. N. Yeltsin, Yekaterinburg, Russia
fYear
2014
fDate
7-13 Sept. 2014
Firstpage
720
Lastpage
721
Abstract
The present paper concerns the method for determination of heat absorption when soldering the microwave devices. Heat absorption evaluation for multiple soldering the microwave devices with the leading wires of various diameters is carried out.
Keywords
absorption; microwave devices; soldering; heat absorption determination; leading wire; microwave device multiple soldering; Heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave & Telecommunication Technology (CriMiCo), 2014 24th International Crimean Conference
Conference_Location
Sevastopol
Print_ISBN
978-966-335-412-5
Type
conf
DOI
10.1109/CRMICO.2014.6959601
Filename
6959601
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