DocumentCode
1564404
Title
Comparison of Wax and Wax-free Mounting of Irregular Piezocomposite Materials for Thinning for High-frequency Medical Devices
Author
Bernassau, A.L. ; McAneny, J.J. ; McGroggan, T. ; Button, T.W. ; Hughes, H. ; Meggs, C. ; Cochran, S.
Author_Institution
Inst. for Med. Sci. & Technol., Univ. of Dundee, Dundee
fYear
2008
Firstpage
100
Lastpage
104
Abstract
Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and increase the yield of such components when they reach production.
Keywords
biomedical equipment; biomedical ultrasonics; electrodes; filled polymers; image resolution; piezoceramics; piezoelectric devices; polishing; porous materials; surface finishing; array electrode; high-frequency medical device; mechanical lapping; photolithographic patterning; piezoceramic-polymer composite material; piezocomposite material wax mounting; piezocomposite material wax-free mounting; spatial resolution; surface polishing; ultrasound imaging array; Biological materials; Biomedical electrodes; Biomedical imaging; Biomedical materials; Frequency; High-resolution imaging; Lapping; Spatial resolution; Surface finishing; Ultrasonic imaging; composite materials; piezoelectric ceramics; substrate thinning; wax mounting;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
978-1-4244-1964-7
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2008.4529018
Filename
4529018
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