Shielded LTCC Inductor as Substrate for Power Converter

The presence of a magnetic substrate below the circuitry created additional parasitic inductances, which resulted in low-frequency oscillations. From simulation, the presence of a metal shield reduces trace inductances and improves circuit performance. There is a minimum shield thickness required to minimize losses associated with ringing. High shield conductivity is necessary to lower the trace inductance and minimize power loss. Traces should be placed close to the shield to minimize inductance.