DocumentCode
1565222
Title
SPAN: Tightly coupled thermal and electrical simulation
Author
Klaassen, B. ; Paap, K.L.
Author_Institution
GMD-SET, St. Augustin, Germany
fYear
1993
Firstpage
294
Lastpage
298
Abstract
A method is presented to combine solvers for ordinary and partial differential equations, like SPICE and ANSYS, for thermal-electrical analysis of integrated circuits or systems. A sketch of a first prototype program (SPAN) is given together with the theoretical background, which makes use of convergence principles from waveform relaxation. The approach can also be extended to more general problems within mechatronics simulation
Keywords
circuit CAD; digital simulation; integrated circuit design; integrated circuit modelling; iterative methods; mechatronics; partial differential equations; ANSYS; SPAN; SPICE; accelerometers; convergence principles; electrical simulation; integrated circuits; mechatronics; mechatronics simulation; partial differential equations; prototype program; thermal simulation; thermal-electrical analysis; waveform relaxation; Circuit analysis; Circuit simulation; Coupling circuits; Mechatronics; Partial differential equations; Prototypes; SPICE; Silicon; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1993, with EURO-VHDL '93. Proceedings EURO-DAC '93., European
Conference_Location
Hamburg
Print_ISBN
0-8186-4350-1
Type
conf
DOI
10.1109/EURDAC.1993.410653
Filename
410653
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