DocumentCode
1566317
Title
The challenges and directions for the mass-production of highly-reliable, high-density 1T1C FRAM
Author
Kang, Y. ; Lee, S. Y.
Author_Institution
Advanced Technology Development Team 2, Semiconductor R&D Center, Memory Division, Samsung Electronics Co. Ltd., San #24, Nongseo-dong, Kiheung-gu, Yongin-si, Kyungki-do 449-711, Korea
fYear
2008
Firstpage
1
Lastpage
2
Abstract
The directions to overcome the challenges, which we meet in the mass-production of highly-reliable high-density 1T/1C FRAM, are suggested. Controlling of the wide variations of individual cell signals and the exclusion of the weak cells with tailed cell signals will provide enough sensing signal margin, which is crucial for the safe and reliable operation of 1T/1C FRAM, and are the two key factors for the success of the mass-production of highly-reliable and high-density 1T/1C FRAM. The variations of cell to cell signals have been greatly reduced by improving process uniformity around cells and minimizing the integration-induced degradation of ferroelectric capacitor. The complete screening of weak cells with tailed sensing signals have been achieved by the introduction of the cell test with an external reference voltage. The 64 Mb experimental FRAM with the new processes and the novel test scheme has showed large sensing margins of ∼200mV and excellent reliability properties.
Keywords
Capacitors; Ferroelectric films; Ferroelectric materials; Gaussian distribution; Nonvolatile memory; Random access memory; Signal processing; Stress; Temperature distribution; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectrics, 2008. ISAF 2008. 17th IEEE International Symposium on the
Conference_Location
Santa Re, NM, USA
ISSN
1099-4734
Print_ISBN
978-1-4244-2744-4
Electronic_ISBN
1099-4734
Type
conf
DOI
10.1109/ISAF.2008.4688161
Filename
4688161
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