• DocumentCode
    1566317
  • Title

    The challenges and directions for the mass-production of highly-reliable, high-density 1T1C FRAM

  • Author

    Kang, Y. ; Lee, S. Y.

  • Author_Institution
    Advanced Technology Development Team 2, Semiconductor R&D Center, Memory Division, Samsung Electronics Co. Ltd., San #24, Nongseo-dong, Kiheung-gu, Yongin-si, Kyungki-do 449-711, Korea
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The directions to overcome the challenges, which we meet in the mass-production of highly-reliable high-density 1T/1C FRAM, are suggested. Controlling of the wide variations of individual cell signals and the exclusion of the weak cells with tailed cell signals will provide enough sensing signal margin, which is crucial for the safe and reliable operation of 1T/1C FRAM, and are the two key factors for the success of the mass-production of highly-reliable and high-density 1T/1C FRAM. The variations of cell to cell signals have been greatly reduced by improving process uniformity around cells and minimizing the integration-induced degradation of ferroelectric capacitor. The complete screening of weak cells with tailed sensing signals have been achieved by the introduction of the cell test with an external reference voltage. The 64 Mb experimental FRAM with the new processes and the novel test scheme has showed large sensing margins of ∼200mV and excellent reliability properties.
  • Keywords
    Capacitors; Ferroelectric films; Ferroelectric materials; Gaussian distribution; Nonvolatile memory; Random access memory; Signal processing; Stress; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 2008. ISAF 2008. 17th IEEE International Symposium on the
  • Conference_Location
    Santa Re, NM, USA
  • ISSN
    1099-4734
  • Print_ISBN
    978-1-4244-2744-4
  • Electronic_ISBN
    1099-4734
  • Type

    conf

  • DOI
    10.1109/ISAF.2008.4688161
  • Filename
    4688161