DocumentCode
156672
Title
Advanced CMOS reliability challenges
Author
Prasad, C.
Author_Institution
Logic Technol. Dev. Quality & Reliability, Intel Corp., Hillsboro, OR, USA
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
2
Abstract
This work reviews transistors of advanced CMOS process nodes from a reliability perspective and covers some of the important challenges and solutions. Physical mechanisms for various modes are investigated for 65nm to 22nm nodes with focus on disruptive changes such as HK/MG and Tri-gate/FinFET. The importance of modeling non-idealities and variation is also emphasized, and projections are made for scaling to sub-20nm with comparisons to existing research.
Keywords
CMOS integrated circuits; integrated circuit modelling; integrated circuit reliability; HK-MG; Trigate-FinFET; advanced CMOS reliability process; physical mechanism; size 65 nm to 22 nm; Aging; Degradation; FinFETs; Integrated circuit reliability; Logic gates; Optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-DAT.2014.6834931
Filename
6834931
Link To Document